《LCM工艺知识介绍.pptVIP

卡口对位JIG Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. * * LCM工艺知识介绍 Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. 目录 一、COG介绍及常见不良现象 二、FOG介绍及常见不良现象 三、模块整体结构（事例分析） 四、 LCM TEST（SAMSUNG) 五、 工艺改善 Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. 一、COG介绍及常见不良现象 1.1 COG结合原理