SMT元器件知识技巧.ppt

元器件知识 SMT元器件 拒收状况2 Reject Condition 理想状况Target Condition 允收状况3 Accept Condition 理想状况Target Condition 1.焊錫帶是凹面並且從晶片端電極底部延伸到頂部的2/3T以上。 2.錫皆良好地附著於所有可焊接面。 1.Solder flow up from land (bottom of component solder termination to the 2/3 Height of component (T) 2.Good solder fillet on the all solder able terminations (face) T 允收状况11 Accept Condition 　　　 h≧1/4 T X≧1/4 T 拒收状况11Reject Condition X1/4 T h1/4 T 1.焊錫帶延伸到晶片端電極高度的25%以下(MI)。 　(h＜1/4T) 2.焊錫帶從晶片外端向外延伸到焊墊端的距離為晶片高度的25%以下(MI)。 　(X＜1/4T) 3.Whichever is rejected . 理想状况Target Condition H 1.焊錫帶是凹面並且從晶片端電極底部延伸到頂部的2/3H以上。 2.錫皆良好地附著於所有可焊接面。 1.Solder flow up from land (bottom of component solder termination to the 2/3 Height of component (T) 2.Good solder fillet on the all solder able terminations (face) 允收状况12 Accept Condition 1.焊錫帶稍呈凹面並且從晶片端電極底部延伸到頂部。 2.錫未延伸到晶片端電極頂部的上方。 3.錫未延伸出焊墊端。 4.可看出晶片頂部的輪廓。 1.Solder concave fillet be formed from land to top of component 2.Solder do not overhang component 3.Solder do not spread out of land 4. Shape (profile) of component termination be visible 拒收状况12 Reject Condition 1.錫已超越到晶片頂部的上方 　(MI) 。 2.錫延伸出焊墊端(MI)。 3.看不到晶片頂部的輪廓(MI) 　。 4.Whichever is rejected . 理想状况Target Condition 1.無任何錫珠、錫渣殘留於 　PCB。 1.No solder ball and solder dross leave on PCB 允收状况13 Accept Condition 可被剝除者D≦ 10mil 不易被剝除者L≦ 10mil 1.錫珠、錫渣不論可被剝除者或不易被剝除者,直徑D或長度L≦10mil。(D,L≦10mil) 1.The diameter of solder ball / solder dross which can remove or not shall small than 10 mil 拒收状况13 Reject Condition 可被剝除者D 10mil 不易被剝除者L 10mil 1.錫珠、錫渣不論可被剝除者 或不易被剝除者,直徑D或長度L10mil。(D,L10mil)(MI)且10mil每平方英寸不得超過5顆 2.Whichever is rejected . 理想状况Target Condition R1 + C1 Q1 R2 D2 1.零件正確組裝於兩錫墊中央。 2.零件之文字印刷標示可辨識。 3.非極性零件文字印刷的辨識排列方向統一。（由左至右，或由上至下） 1.Component are centered between their lands 2.Component markings are visible 3.Non-polarized components need to be oriented so that markin