[第二讲电子学基本知识11.pptVIP

2011-02-23 中国科学技术大学 快电子实验室 刘树彬? * Impedance Considerations Layer 1 (Outer) Layer 6 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) FOIL FOIL PRE-PREG PRE-PREG PRE-PREG INNER LAYER INNER LAYER Layer 1 (Outer) Layer 6 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) FOIL FOIL PRE-PREG PRE-PREG PRE-PREG INNER LAYER INNER LAYER During the Bonding process, press temperature and pressure have a great influence on substrate heights, which greatly affects impedance. It is important to use the Finished Post-Processed height when calculating Impedance Layer stackup 叠板和层压过程 Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile . Copyright 2004-2011 Aspose Pty Ltd. 2011-02-23 中国科学技术大学 快电子实验室 刘树彬? * Impedance Considerations Layer 1 (Outer) Layer 6 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) FOIL FOIL PRE-PREG PRE-PREG PRE-PREG INNER LAYER INNER LAYER Layer 1 (Outer) Layer 6 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) FOIL FOIL PRE-PREG PRE-PREG PRE-PREG INNER LAYER INNER LAYER During the Bonding process, press temperature and pressure have a great influence on substrate heights, which greatly affects impedance. It is important to use the Finished Post-Processed height when calculating Impedance Layer stackup 叠板和层压过程 Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile . Copyright 2004-2011 Aspose Pty Ltd. 2011-02-23 中国科学技术大学 快电子实验室 刘树彬? * Impedance Considerations Layer 1 (Outer) Layer 6 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) FOIL FOIL PRE-PREG PRE-PREG PRE-PREG INNER LAYER INNER LAYER Layer 1 (Outer) Layer 6 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) FOIL FOIL PRE-PREG PRE-PREG PRE-PREG INNER LAYER INNER LAYER During the Bonding process, press temperature and pressure have a great influence on substrate heights, which greatly affects impedance. It is important to use the