手机生产流程讲义.ppt

手機生產流程 產前准備 產后包裝 * * * * * * * * LG客戶 交貨管控 下定單 供應鏈/物控 查點不足物料 生管 追要不足物料 倉庫 根據訂單及物料﹑生產狀況安排生產﹐開工單 根據工單備料﹑發料 前加工 產線上線 掃描登記 錫膏印刷 泛用機貼片1~2 迴焊爐前目檢 API MASK比對 AOI檢查 貼2D Label 裁板 手焊聽筒﹑話筒 LCD 組裝 點膠 Can shield組裝 BAKING LCD測試 PCB投入 PCB Loading 中速機貼片1~6 目檢 回流焊 搬板 貼按鍵 貼insulator 產線生產 POWER TEST CMT測試 終檢 包裝 DEK HOZ 02i Specification of DEK HOZ 02i Solder Printing Max. Board Size: 508mm*508mm Min. Board Size: 50mm*40mm Board Thinkness: 0.2mm~6mm Max Print Speed: 2mm~150mm/sec Accuracy And Repeatability : 1.6CPK@+/-25μm 『Screen Clean Module』 『Camera System Module』 『Squeegee Module』 Specification of SE 300 PCB Size 101*35mm~508*508mm Max Inspection Area 508*503mm Inspection Speed 29cm2/sec Scan Window 10*20mm Solder Thickness 50*350μm Machine capability---Solder Inspection Type SI-G200 PCB Size 50*50mm~460*410mm High-speed Head Placement Rate 45000cph Placement Precision ±0.045(3σ)mm Part Size 0201chip~100*50mm 『SI-G200』 『High-speed Head』 『CCD CameraⅡ』 『CCD Camera Ⅰ』 Specification of SI-G200 Return Machine capability---Middle Speed Machine Tr7160 20μ 15μ Machine capability---Automated Optical Inspection Panasonic CM402-L with Maglev technology Sony F209 Panasonic CM402-L  CM402-L Machine capability---Multifunctional Machine Reflow Profile Reflow soldering with Lead-free, KIC 24/7 monitor system KIC24/7 Thermal management system TNR40-628PH-L Return Machine capability---Reflow oven X-ray, side-view scope, Stereo-scope are equipped in shop floor for quick root cause analysis. Nikon Stereo-scope Erase-scope Open tube X-Ray machine - XD7500- X-Ray XD7500 Specification Machine capability---Inspecti