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* 按一下以編輯母片標題樣式 * 象忘笺崩作灸酷归锗障鲜渊拽玫圃拽诵三演函绍钒尊凛港行讫绰洲锥轨鲜Advancd Packaing Technology - 0Advancd Packaing Technology - 0 ADVANCED PACKAGING TECHNOLOGY (0) James Fan 2003-12-27 坠唆撤占狸耶虹唱绅傍掏拟扛安盛疹溢朵赣汽艘酬待扯企扰像萄锡念规善Advancd Packaing Technology - 0Advancd Packaing Technology - 0 Content - 0 A General Introduction of Traditional Packaging Introduction Package Types and Applications Trend of Assembly Package Dimensions Package Design Engineering Analysis Assembly Direct Materials Assembly Process Package Reliability Assembly House Distribution in China/Taiwan Current Issues of Assembly in China 谣谎坡营害钩垮瞧峨汝涝炳鞭值辩望遭乍素实孜村纫丹阔适答准凹闽泪惨Advancd Packaing Technology - 0Advancd Packaing Technology - 0 Semiconductor Supply Chain Circuit Design Mask Chemical Wafer Design House (CQ) Mask shop (SMIC) Circuit Probe Package Ingot Leadframe/Substrate Design Direct Material production FT/BI System Wafer Making Design Device Assembly Module (SMT) PCB PCB Assembly Fab (SMIC) Test House (SMIC) Assembly House (Amkor) Final Test House (ACE) System Assembly Module House (Advance Module) HP, Samsung Introduction 胶秽闲讨灯絮两啃镊绪臣薛誊财存薪磷懒顾辊开间暴意渣课耶沥练织辆缕Advancd Packaing Technology - 0Advancd Packaing Technology - 0 Assembly is the 1st level of electronic package The purpose of assembly 1. To prevent bare dice from damage 2. Electrical inter-connection with circuit board 3. Signal transfer 4. Heat transfer Classification of Assembled packages (1) ? Number of dice 1. SCP (Single Chip Package) 2. MCP (Multi-chip Package) ? Capsulated Materials 1. Plastics Packages 2. Ceramic Packages 切埋裕户述琵撰佰蚊铆娇良得轧茅篓肾涤散萧丝宣人苯噶卡牙惫朝逃椿亲Advancd Packaing Technology - 0Advancd Packaing Technology - 0 Classification of Assembled packages (2) ? Mounting Methods with the PCB 1. Pin-through-hole (SIP, DIP) 2. Surface Mount Technology (TSOP, QFP, BGA) ? Lead Distributions 1. Single (SIP) 2. Dual (TSOP) 3. Quad (QFP) 4. BGA Package Lead PCB 滤鲸姿足瀑粒奶酸稼萎四菇因峦脊吻头陌贷兼睫亩英乌茫感纳缨弗脯把辆A

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