基于聚合物封装的光纤光栅压力传感器.docxVIP

基于聚合物封装的光纤光栅压力传感器刘明尧 卢一帆 张志建 王佳 史登辉（武汉理工大学机电工程学院 湖北武汉 430070）摘要：本文设计并研究了一种光纤光栅压力传感器，FBG1与FBG2串联连接，其中FBG1直接封装于聚合物之中，而FBG2先粘贴于弹性基体上再封装于聚合物之中。本文推导了传感器的灵敏度和解耦算法，并且使用有限元法计算了本传感器压力灵敏度和温度灵敏度，最后对本方法进行了实验验证。实验结果表明FBG1和FBG2的压力灵敏度分别为197.4pm/MPa和95.7pm/MPa，温度灵敏度分别为47.2pm/MPa和36pm/MPa，具有良好的线性度，较小的回程误差，并且符合该传感器感知的压力和温度解耦条件。同时，随着聚合物小圆环直径增加，基体的应变量越来越大，并趋近于没有基体时聚合物的应变量。研究表明，较之传统的聚合物封装的光纤光栅压力传感器，本传感器的聚合物与套筒不宜脱落，两者之间的非固结连着可以增加传感器灵敏度，并且本传感器具有温度补偿功能。关键字：光纤光栅；压力传感器；温度补偿；有限元分析中图分类号及文献标识码：TN212.14 A 国家标准学科分类代码：460.4035FBG pressure sensor based on the polymer packaging Liu Mingyao，Lu Yifan，Zhang Zhijiang，Wang Jia，Shi Denghui（School of Mechanical Electrical Engineering，Wuhan University of Technology，Wuhan 430070，China）Abstract: This paper designed and studied a FBG sensor. FBG1 and FBG2 were connected in series，and FBG1 was directly encapsulated in the polymer，but FBG2 was pasted on the elastic substrate and then encapsulated in the polymer. In this paper，the sensitivity of the sensor and decoupling algorithm were theoretically derived，and the pressure sensitivity and the temperature sensitivity were calculated by use of finite element method. Finally，the method is verified by experiments. Experimental results show that the pressure sensitivities of FBG1 and FBG2 respectively were 197.4pm / MPa and 95.7pm / MPa，and temperature sensitivities respectively were 47.2pm / MPa and 36 pm/MPa with a good linearity and low hysteresis errors. Meanwhile，the result meted the conditions of decoupling between pressure and temperature. The results showed that with the increase of polymer small ring diameter the dependent variable of basis material should increase，and tend to the dependent variable of the polymer without the basis material. Compared with conventional pressure sensor based on polymer packaging，its polymer is not easy to fall off from the sleeve，and the sensor sensitivity can be increased because of unconsolidated attached between them，and the sensor has a temperature compensation function.