图形电镀质量控制.docVIP

缺陷代码 Defect code 缺陷名称 Defect name 缺陷描述/图片 Defect Description / Pictures 检验方法 Test methods 接收标准/图片 Receive standard / images 处理方法 Treatment 5.1 镀层剥离 plating peel off 指所镀金属层发生分离，如锡铜剥离，铜层剥离。 Represents the metal-coated layer separation occurs, such as tin-copper strip, copper strip. 将5.08cm长度测试胶带（一般选用3M）紧贴在镀层表面，以垂直于板面的力迅速拉起。 Length of test tape will be 5.08cm (generally used in the 3M) close to the coating surface to the force perpendicular to the board quickly pull up. 不允许镀层剥离。 Allow plating peel off 报废 scrap 5.2 缺镀 missing plating 指基底金属表面未被电镀金属覆着，如缺镀铜，缺镀锡。 Refers to the base metal surface is not covered with metal plating, such as missing plating of copper, tin shortage. 目视检验或用100X镜。 100X magnifying glass or visual inspection. 不允许缺镀。 missing plating is not allowed. 报废 scrap 5.3 渗镀 Diffusion plating 指线路或PAD、SMT等边缘镀层渗入干膜内造成线路凹凸不平或短路。 Refers to the line or PAD, SMT and other edge of the dry film coating into the cause uneven lines or short circuit. 目视检验或用100X放大镜。 注意区别：渗镀和退膜不净造成的残铜，渗镀造成的镀层凸出部分，表面应光亮，退膜不净造成的残铜则表面发暗。 100X magnifying glass or visual inspection. Note the difference between: diffusion plating and the back film is not the net result of excess copper, diffusion coating layer caused by projection, the surface should be bright, not a net return due to residual membrane surface is dark copper. 不影响线宽间距要求的渗镀可接受，渗镀长度应不超过13mm，注意金手指边的渗镀不应超过0.05mm。 Spacing requirements do not affect the diffusion coating width is acceptable, diffusion coating length should not exceed 13mm, pay attention to finger edge diffusion coating should not exceed 0.05mm. 修理 Repair 缺陷代码 Defect code 缺陷名称 Defect name 缺陷描述/图片 Defect Description / Pictures 检验方法 Test methods 接收标准/图片 Receive standard / images 处理方法 Treatment 5.4 镀层粗糙 Rough coating 指线路及孔壁镀层表面有微小凸起，凹凸不平。 Refers to the pore wall surface of the coating lines and slightly raised, uneven. 目视或用测孔针。（线路镀层可用绿油前处理磨板结果来判断） Visually or by measuring hole needle. (Green line coating of oil can be pre-judged the results of grinding pla