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The TAAF Process: A Technical Brief for TAAF Implementation January 1989 Executive Summary The test, Analyze, and Fix (TAAF) process is a closed-loop reliability growth methodology. This technical brief provides in a single, concise source document TAAF program management methods, engineering practices, and suggested implementation contract language for the program manager and engineer. Because such a document has not been previously available, there is considerable misunderstanding regarding the purpose and scope of the TAAF process. Some, for example, equate TAAF with reliability demonstration testing. Nothing could be further from the truth. The purpose of TAAF is not to prove that a reliability goal has been met, but rather to deliberately search out and eliminate deficiencies. In TAAF, failures are welcome. The TAAF concept is necessary because, even with the very best of modern engineering methods, initial designs for mechanical or electronic systems that are complex or that involve new technology have reliability deficiencies that are difficult to fully detect and eliminate through design analysis. The TAAF process surfaces these problems early and eliminates them before rate production. Tenfold reliability improvements are not unusual. Our goal in publishing this document is to help the program manager and engineer assure the design and delivery of reliable weapon systems. //signed// Frank S. Goodell, BGen, USAF Special Assistant for, Reliability and Maintainability SAF/AQ and DCS/LE //signed// S. J. Lorber Deputy Chief of Staff for Product Assurance Testing Army Material Command HQ AMC //signed// W.J. Willoughby, Jr. Director, Reliability, Maintainability, and Quality Assurance Office of the Assistant Secretary of the Navy (Shipbuilding Logistics I. Introduction A. Purpose The Departments of the Army, Navy, and Air Force have combined their efforts in preparing this document because of concern over a common problem pervasive in military sys

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