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Development of a novel non-contact inspection technique to detect micro cracks under the surface of a glass substrate by thermal stress-induced light scattering method.pdf

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Development of a novel non-contact inspection technique to detect micro cracks under the surface of a glass substrate by thermal stress-induced light scattering method.pdf

Optics Laser Technology 90 (2017) 80–83 Contents lists available at ScienceDirect Optics Laser Technology journal homepage: /locate/optlastec Full length article Development of a novel non-contact inspection technique to detect micro cracks under the surface of a glass substrate by thermal stress-induced light scattering method Yoshitaro Sakata?, Nao Terasaki, Kazuhiro Nonaka Advanced Manufacturing Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), Saga 841-0052, Japan MARK ARTICLE INFO Keywords: Light scattering method Thermal stress Non-contact inspection Micro crack Transparency material On-site measurement ABSTRACT Fine polishing techniques, such as a chemical mechanical polishing treatment, are important techniques in glass substrate manufacturing. However, these techniques may cause micro cracks under the surface of glass substrates because they used mechanical friction. A stress-induced light scattering method (SILSM), which was combined with light scattering method and mechanical stress e?ects, was proposed for inspecting surfaces to detect polishing-induced micro cracks. However, in the conventional SILSM, samples need to be loaded with physical contact, and the loading point is invisible in transparent materials. Here, we introduced a novel noncontact SILSM using a heating device. A glass substrate was heated ?rst, and then the light scattering intensity of micro cracks was detected by a cooled charge-couple device camera during the natural cooling process. Results clearly showed during the decreasing surface temperature of a glass substrate, appropriate thermal stress is generated for detecting micro cracks by using the SILSM and light scattering intensity from micro cracks changes. We con?rmed that non-contact thermal SILSM (T-SILSM) can detect micro cracks under the surface of transparent materials. 1. Introduction Fine polishing techniques, such as a chemical mechanical polishing treatment (CMP), are some of