Bond-Ply 800粘结层800.PDF

Bond-Ply? 800 Thermally Conductive, Fiberglass Reinforced Pressure Sensitive Adhesive Tape Features and Benefits ? Thermal impedance: 0.60°C-in2/W (@50 psi) ? High bond strength to most epoxies and metals ? Double-sided, pressure sensitive adhesive tape ? High performance, thermally conductive acrylic adhesive ? More cost-effective than heat-cure adhesive, screw mounting or clip mounting Bond-Ply? 800 is a thermally conductive, electrically isolating double-sided tape. Bond-Ply? 800 is utilized in lighting applications that require thermal transfer and electric isolation. High bond strengths obtained at ambient temperature lead to significant processing cost savings in labor, materials and throughput due to the elimination of mechanical fasteners and high temperature curing. Typical Applications Include: ? Mount LED assembly to troffer housing ? Mount LED assembly to heat sink ? Mount heat spreader onto power converter PCB or onto motor control PCB ? Mount heat sink to BGA graphic processor or drive processor PROPERTY Color TYPICAL PROPERTIES OF BOND-PLY 800 IMPERIAL VALUE METRIC VALUE TEST METHOD Gray Gray Visual Reinforcement Carrier Fiberglass Fiberglass — Thickness (inch) / (mm) 0.005, 0.008 0.127, 0.203 ASTM D374 Elongation (%, 45° to Warp Fill) 70 70 ASTM D412 Tensile Strength (psi) / (MPa) 1500 10 ASTM D412 CTE (um/m-°C), -40°C to +125°C 600 600 ASTM D3386 Continuous Use Temp (°F) / (°C) -40 to 257 -40 to 125 — ADHESION Lap Shear @ RT (psi) / (MPa) (1) 150 1.0 ASTM D1002 ELECTRICAL Dielectric Breakdown Voltage (Vac), 0.005 VALUE 4000 TEST METHOD ASTM D149 Dielectric Breakdown Voltage (Vac), 0.008 6000 ASTM D149 Dielectric Constant (1000 Hz) 4.0 ASTM D150 Volume Resistivity (Ohm-meter) 1011 ASTM D257 THERMAL Thermal Conductivity (W/m-K) 0.8 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Initial Assembly Pressure (psi for 5 seconds) 10 25 50 100 200 TO-220 Thermal Performance (°C/W), 0.005 5.0 5.0 4.8 4.3 4.2 TO-220 Thermal Performance (°C/W), 0.008 6.2 6.0 5.6 5.