芯片相关简写教材.docVIP

1、CPU3DNow!（3D?no?waiting，无须等待的3D处理）AAM（AMD?Analyst?Meeting，AMD分析家会议）ABP（Advanced?Branch?Prediction，高级分支预测）ACG（Aggressive?Clock?Gating，主动时钟选择）AIS（Alternate?Instruction?Set，交替指令集）ALAT（advanced?load?table，高级载入表）ALU（Arithmetic?Logic?Unit，算术逻辑单元）Aluminum（铝）AGU（Address?Generation?Units，地址产成单元）APC（Advanced?Power?Control，高级能源控制）APIC（Advanced?rogrammable?Interrupt?Controller，高级可编程中断控制器）APS（Alternate?Phase?Shifting，交替相位跳转）ASB（Advanced?System?Buffering，高级系统缓冲）ATC（Advanced?Transfer?Cache，高级转移缓存）ATD（Assembly?Technology?Development，装配技术发展）BBUL（Bumpless?Build-Up?Layer，内建非凹凸层）BGA（Ball?Grid?Array，球状网阵排列）BHT（branch?prediction?table，分支预测表）Bops（Billion?Operations?Per?Second，10亿操作/秒）BPU（Branch?Processing?Unit，分支处理单元）BP（Brach?Pediction，分支预测）BSP（Boot?Strap?Processor，启动捆绑处理器）BTAC（Branch?Target?Address?Calculator，分支目标寻址计算器）CBGA?(Ceramic?Ball?Grid?Array，陶瓷球状网阵排列)CDIP?(Ceramic?Dual-In-Line，陶瓷双重直线)Center?Processing?Unit?Utilization，中央处理器占用率CFM（cubic?feet?per?minute，立方英尺/秒）CMT（course-grained?multithreading，过程消除多线程）CMOS（Complementary?Metal?Oxide?Semiconductor，互补金属氧化物半导体）CMOV（conditional?move?instruction，条件移动指令）CISC（Complex?Instruction?Set?Computing，复杂指令集计算机）CLK（Clock?Cycle，时钟周期）CMP（on-chip?multiprocessor，片内多重处理）CMS（Code?Morphing?Software，代码变形软件）co-CPU（cooperative?CPU，协处理器）COB（Cache?on?board，板上集成缓存，做在CPU卡上的二级缓存，通常是内核的一半速度））COD（Cache?on?Die，芯片内核集成缓存）Copper（铜）CPGA（Ceramic?Pin?Grid?Array，陶瓷针型栅格阵列）CPI（cycles?per?instruction，周期/指令）CPLD（Complex?Programmable?Logic?Device，复杂可程式化逻辑元件）CPU（Center?Processing?Unit，中央处理器）CRT（Cooperative?Redundant?Threads，协同多余线程）CSP（Chip?Scale?Package，芯片比例封装）?CXT（Chooper?eXTend，增强形K6-2内核，即K6-3）Data?Forwarding（数据前送）dB（decibel，分贝）DCLK（Dot?Clock，点时钟）DCT（DRAM?Controller，DRAM控制器）DDT（Dynamic?Deferred?Transaction，动态延期处理）Decode（指令解码）DIB（Dual?Independent?Bus，双重独立总线）DMT（Dynamic?Multithreading?Architecture，动态多线程结构）DP（Dual?Processor，双处理器）DSM（Dedicated?Stack?Manager，专门堆栈管理）DSMT（Dynamic?Simultaneous?Multithreading，动态同步多线程）DST（Depleted