Creep corrosion cracking.pdf

Corrosion Science 86 (2014) 142–148Contents lists available at ScienceDirect Corrosion Science journal homepage: www.elsevier .com/locate /corsc iCreep corrosion cracking of Sn–3.0Ag and Sn–0.5Cu solder alloys in NaCl solution/10.1016/j.corsci.2014.05.004 0010-938X/ 2014 Elsevier Ltd. All rights reserved. ? Corresponding author. Tel.: +81 93 884 3356; fax: +81 93 884 3351. E-mail address: yokken@post.matsc.kyutech.ac.jp (K. Yokoyama).Ken’ichi Yokoyama a,?, Akihide Nogami a, Jun’ichi Sakai b,c aDepartment of Materials Science and Engineering, Kyushu Institute of Technology, 1-1 Sensui-cho, Tobata-ku, Kitakyushu 804-8550, Japan b Faculty of Science and Engineering, Waseda University, 3-4-1 Okubo, Shinjuku-ku, Tokyo 169-8555, Japan cKagami Memorial Laboratory for Materials Science and Technology, Waseda University, 2-8-26, Nishiwaseda Shinjuku-ku, Tokyo 169-0051, Japan a r t i c l e i n f oArticle history: Received 24 December 2013 Accepted 5 May 2014 Available online 14 May 2014 Keywords: A. Electronic materials A. Tin B. SEM C. Intergranular corrosion C. Stress corrosiona b s t r a c t The surface crack nucleation of Sn–3.0Ag and Sn–0.5Cu solder alloys has been examined by performing sustained tensile-loading tests in 0.9 mass% NaCl solution at room temperature. For Sn–3.0Ag alloy, many cracks nucleate and propagate on the side surface of the specimen, similarly to Sn–3.0Ag–0.5Cu alloy reported previously. For Sn–0.5Cu alloy, such cracks are not observed, and ordinary creep deformation occurs in the solution. The effect of sustained applied stress, i.e., creep, on the dissolution of ions is smal- ler for Sn–0.5Cu alloy than for Sn–3.0Ag alloy. The present results suggest that there are differences in the susceptibility to cracking under applied stress in a solution, i.e., creep corrosion cracking, among lead-free solder alloys.  2014 Elsevier Ltd. All rights reserved.1. Introduction Lead-free solders including Sn–Ag–Cu, Sn–Ag and Sn–Cu alloys exhibit better corrosi