印制板中间偏孔在压合过程的影响因素分解.pdfVIP

覆铜箔层压板多层层压技术 CCLMLB Lamination 2012秋季国际PCB技术/信息论坛 印制板中间偏孔在压合过程的影响因素研究 Paper Code: A-035 冯 立 何 为 黄雨新 何 杰 电子科技大学 徐 缓 周 华 罗 旭 戴冠军 博敏电子股份有限公司 摘 要 通过印制电路板层压过程的研究，探讨了导致中间偏孔问题的影响因素。包括对压机 平整度、压盘温度均匀性、开料烤板、牛皮纸类型和叠构方式以及基板材料等影响因 素的对比测试，统计各可能影响因素下出现中间偏孔的不良率。结果表明，压机平整 度差与温度不均匀性以及基板材料本身涨缩的不稳定性是导致中间偏孔不良率偏高的 主要因素。 关键词 中间偏孔；平整度；温度均匀性；材料涨缩 中图分类号：TN41 文献标识码：A 文章编号：1009-0096（2012）增刊-0180-07 Study on the influence factors of middle hole-shift for PCB lamination FENG Li HE Wei HUANG Yu-xin HE Jie XU Huan ZHOU Hua LUO Xu DAI Guan-jun Abstract The influence factors led to middle hole-shift problems have been studied through the discussing of the printed circuit board lamination in this article. It includes the comparative testing on different influence factors such as compressor smoothness, temperature uniformity of pressure plate, baking process, the type and composite structure of kraft paper, substrate materials etc. The defect rates of middle hole-shift under all these possible influence factors have also been gathered. The result indicates that the main influence factors led to a higher defect rate of middle hole-shift are bad smoothness and non-uniform temperature of compressor as well as the instability of expansion for subs