智能电脑散热系统设计报告大学论文.docVIP

目录 1、前言··································································1 2、总体方案设计 ·························································2 2.1设计内容··························································2 2.2方案比较··························································2 2.3方案论证··························································3 2.4方案选择··························································3 3、单元模块电路简介与设计················································4 3.1本系统部分器件介绍················································4 3.1.1 DS18B20 温度传感器简介··········································4 3.1.2 STC89C52RC 单片机简介···········································4 3.1.3 ULN2003 芯片简介···············································5 3.2单元模块电路设计··················································6 3.2.1 电源电路·····················································6 3.2.2 单片机主芯片电路··············································7 3.2.3 时钟电路·····················································7 3.2.4 复位电路·····················································8 3.2.5显示电路······················································8 3.2.6温度检测电路··················································9 3.2.7 按键控制电路··················································9 3.2.8 报警及电机电路················································9 3.3模块连接总电路···················································10 4、软件设计·····························································11 4.1程序设计原理及所用工具········································11 4.2主程序设计····················································11 4.3主要模块主程序设计············································12 5、系统调试·····························································15 6、系统功能、指标参数···················································18 7、结论·································································19 8、总结与体会···························································20 9、参考文献······························································21 附录1：ISIS仿真图、PCB板图、实物图 附录2：程序源