5) FOF设计ACF.pdf

OTP ACF Interconnect Alternative Interconnect for Solder or Mechanical Connect FOF Interconnect Area Design Conductive Material Division Product Development Section 3 Material Sales Marketing Dept. Section 2 Bottom FPC Top FPC 1.5mm 2.0mm 2.0mm 4.0mm 0.5mm Basic Design Guideline for FOF Connection In case designing FOF (FPC on FPC), FPC placed on bonding stage (bottom) should be larger than top FPC as shown below not to flow out ACF adhesive after bonding. Fixture 1.6mm x ACF length +1mm Heat Tool 1.5mm 1.5mm 2.0mm Bad Example: ACF will be flowing out on bonding stage and FPC can not remove from bonding stage after bonding. Good Example: No ACF will be flowing out on bonding stage after bonding. 0.5mm Design Guideline of FPC Cover-lay Resist Coating on PWB Not Preferred Please remove Cover-lay and resist around the leads and bonding area in order to apply optimum bonding pressure during thermal-compression. Appropriated Deign Push Back Effect on FPC Can Not Apply Bonding Pressure Design of Back Side of FPC Appropriate Design Bad Design Cover-lay or Cu shielding on back side of FPC is good for repair purpose. Reinforcing Board Blue adhesive layer in FPC might absorb bonding pressure and interfere optimum compression of conductive particle. This simple design structure is most appropriated design PI and Cu should be soft and thinner to reduce push back and recognize fiducial mark through PI. Trace Design Guideline for FPC Appropriate Design Bad Design TBD Design Please let us review a drawing in details. Avoid any design which may cause “ Short” by conductive particles jamming between Lead and Lead. This design has a possibility to cause a partial compression since only crossing point could be compressed on back side on FPC. When ACF bonding area shall be applied on center of 2 bonding line with this design, seepage of ACF adhesive shall not be good enough to keep peel strength test. Rear lead running on back side of FPC shouldn’t be