汽车电子封装趋势考量及生产的特殊性详解.pdfVIP

中国集成电路 汽车电子 CIC China lntegrated Circult 汽车电子封装趋势， 考量及生产的特殊性 ???h ????? ?? ???? ??? Arcedera, ?? ????? （安靠封装测试，美国） 摘要：汽车电子是半导体行业成长较快的领域。安全、舒适、互联，和个性化是未来十年成长的主要动力。 可靠性和性价比优势使支架封装仍占主导，而其它封装，如PBGA、堆叠式芯片尺寸封装（SCSP），和晶圆 级封装??WLP）等，也正得到启用。MLF誖??QFN）应用广泛，具有很好的热电性能和设计灵活性。类似凹槽 侧面可湿性焊点技术的创新，让MLF誖这种传统封装更具吸引力。更多传感器和 ?? 用于汽车应用，封 装形式主要为 MLF誖, LGA 和“凹槽 ??”。资讯娱乐系统需要采用更多类型的封装形式。汽车电子封 装生产所涉及的供应商管理、可靠性测试等因素必须与严格的汽车标准保持一致。 关键词：汽车；封装；传感器；QFN??资讯娱乐 Trends, Considerations, and Manufacturing Differentiation for Automotive Electronic Packaging Deborah Patterson, Marc Mangrum, Adrian Arcedera, John Sniegowski （ ） Amkor Technology, Inc., Chandler, Arizona, USA ：Automotive electronics currently represent one of the higher semiconductor growth segments. Safety, com- Abstract fort, connectedness and individual expression will drive growth in automotive electronics over the coming decade. Lead frame packages represent the largest segment of semiconductor packaging with a long track record of reliable and cost effective options. However, other package formats such as Plastic Ball Grid Array??PBGA）, Stacked Chip Scale Packages??SCSP）, and Wafer Level Packaging??WLP）, are gaining acceptance. MicroLeadFrame??MLF, also 誖 誖 known as QFN）is one of the most commonly used lead frame packages in the world for its broad range of sizes, long history of excellent reliability, automotive inspection protocols, and design flexibility. Innovations to MLF ??QFN）, 誖 such as the side wettable fill