多层PCB工艺能力指标.doc

多层板工艺能力指标 项目加工能力（括号内为公制）备注最大拼版尺寸 max panel size?内层最小线宽/线距 innerlayer line width/space (min)?最小内层隔离环宽 min innerlayer clearance?最小内层焊盘 min innerlayer pad指焊环宽最薄内层厚度 min core thickness不含铜箔最小绝缘层厚度 min dielectric thickness?内层铜箔厚度 thickness of inner copper?外层底铜厚度 thickness of outerlayer base copper?完成板厚度 thickness of finished panel?完成板厚度公差tolerance of finished panel thickness板厚＜1.0mm4-8层板1.0mm≤板厚＜2.0mm4-8层板≥10层板板厚≥2.0mm?内层表面处理工艺surface treating technic of innerlayer?层数layer number?多层板层间对准度registration of innerlayer to innerlayer?最小钻孔孔径 min drilling diameter?最小完成孔径min diameter of finished hole ?孔位精度accuracy of hole position?槽孔公差tolerance of drilled slot?镀通孔孔径公差tolerance of PTH diameter?非镀通孔孔径公差tolerance of NPTH diameter?孔电镀最大纵横比max A.R. of PTH?孔壁铜厚度 PTH hole copper thickness?外层图形对位精度 image to image tolerance?外层最小线宽/线距 outer layer line width/space(min)?蚀刻公差tolerance of line width?阻焊剂种类type of solder mask?阻焊剂厚度 thickness of solder mask?阻焊剂硬度hardness of solder mask?阻焊图形对位精度 solder mask registration tolerance?阻焊桥最小宽度 min solder mask dam?塞油最大孔径max solder mask plug hole diameter?表面处理工艺 surface treating technics?金手指最大镀镍厚度max nickle thickness of gold finger?金手指最大镀金厚度max gold thickness of gold finger?沉镍金镍层厚度范围range of nickle thickness for electroless nickle and immersion gold?沉镍金金层厚度范围range of gold thickness for electroless nickle and immersion gold?外型最小公差min routing dimension tolerance(edge to edge)?孔对边最小公差min routing dimension tolerance(hole to edge)?V槽角度V-cut angle?刨斜边角度范围 range of bevel angle?最小字符宽度/间距 min legend line width/space?线路抗剥强度peel strength of line?离子污染ionic contamination?激光钻孔孔径 laser drilling diameter?BUM加成能力capacity of BUM?阻抗控制及公差 impedance control and tolerance?翘曲度bow and twist?板料种类 type of dielectric material?其他特殊工艺other technics?