元素Sn对Zn-Cu-Bi-Sn 高温软钎料组织和性能的影响.pdfVIP

Trans. Nonferrous Met. Soc. China 25(2015) 879−884 Effects of Sn element on microstructure and properties of Zn−Cu−Bi−Sn high-temperature solder Fei XING, Xiao-ming QIU, Yang-dong LI Key Laboratory of Automobile Materials of Ministry of Education, School of Materials Science and Engineering, Jilin University, Changchun 130025, China Received 24 March 2014; accepted 14 July 2014 Abstract: The microstructures and properties of the Zn−Cu−Bi−Sn (ZCBS) high-temperature solders with various Sn contents were studied using differential scanning calorimetry (DSC), scanning electron microscopy (SEM) and X-ray diffraction (XRD). The results indicate that the increase of Sn content can both decrease the melting temperature and melting range of ZCBS solders and it can also effectively improve the wettability on Cu substrate. The shear strength of solder joints reaches a maximum value with the Sn addition of 5% (mass fraction), which is attributed to the formation of refined β-Sn and primary ε-CuZn5 phases in η-Zn matrix. However, when the content of Sn exceeds 5%, the shear strength decreases due to the formation of coarse β-Sn phase, which is net-shaped presented at the grain boundary. Key words: solder; Zn-based solder; Sn; high-temperature solder; thermal property; wettability 1 Introduction The development of innovative materials has been putting new request to the soldering technology and solders, especially functional materials whose microstructures and properties are sensitive to the changing of temperatures, such as piezoelectric ceramic materials [1−3] and shape memory alloys [4−6]. When brazing these materials with filler metals, the severe joining temperatures (500 °C) are always above the transition temperatures and