VALOR基本操作步骤浅析.ppt

VALOR基本操作指南;VALOR基本操作指南;操作前准備;3.進入此界面後;4.進入此界面後;5.進入此界面就表示連接成功。;EXPORT ODB++ DATA;3.直至出現此界面，一般默認設置。;單擊出現如下對話框;5.單擊此項;6.直至出現此信息，表示完成。;OPEN AND SHORT CHECK;1.進入valor;2.出現此界面表示成功進入;3.依次選擇：檔案\匯入\ODB++;一般選jobdb表示數據存放在自己電腦上。;5. 找到此文檔並雙擊;6.雙擊此文檔;7.雙擊此文檔;9.進入此工作界面(僅介紹常用工具）;11.出現此界面;Open兩個;①單擊short出現;tdojx2;①單擊brolen出現;Net gnd 開路;總結：open or short check 基本操作步驟已經介紹完，但還需大家平時多加練習和操作。Open or short情況比較多，比較復雜，但又非常重要，大家分析時，一般要結合boradfile仔細分析，一一排除。找到其根本原因，將其徹底根治掉。;DFM CHECK;接上述介紹第20頁;依次選擇;開始做DFM CHECK依次選擇;13;分別出現;Assembly Analysis - Partial List;23.Component To Mounting Hole (Primary) (Hole Spacing) 24.Component To Mounting Hole (Secondary) (Hole Spacing) 25.Component To Tooling Hole (Primary) (Hole Spacing) 26.Component To Tooling Hole (Secondary) (Hole Spacing) 27.Hole Under Component (Hole Spacing) 28.Uncapped Via Under Component (Hole Spacing) 29.Wave Solder Component Orientation (Orientation) 30.Component Relative Orientation (Orientation) 31.Component Uncommon Orientation (Orientation) 32.No Orientation Indication (Orient Indication) 33.No Square Pad on THMT pin #1 (Orient Indication) 34.Chip Corner Protection Missing (Guarded Comps ) 35.Chip Edge Protection Missing (Guarded Comps ) 36.Comp. Outside Keepin Area (Keepin/Keepout) 37.Comp.Within Keepout Area (Keepin/Keepout) 38.Comp. Exceed Max Height (Height Restriction) 39.Comp. Under Min Height (Height Restriction) ;Testpoints Analysis 1.Toeprint Testpoints (Review) 2.Via Testpoints (Review) 3.Nets Without Testpoints (Review) 4.Nets With Multiple T