倒装芯片组装集成电路开封方法.PDF

第15卷 第2期 太赫兹科学与电子信息学报 Vo1.15，No.2 2017 年 4 月 Journal of Terahertz Science and Electronic Information Technology Apr.，2017 文章编号：2095-4980(2017)02-0328-05 倒装芯片组装集成电路开封方法 周 帅，郑大勇，王 斌 (工业和信息化部 电子第五研究所，广东 广州 510610) 摘 要：倒装芯片组装集成电路的结构与常规封装不同，导致现行开封技术不完全适用于倒 装芯片组装集成电路。对不同封装形式的倒装芯片组装集成电路结构分析，找出目前制约开封技 术的关键因素。以陶瓷及塑封封装倒装芯片组装集成电路为例，运用热风枪、高温预处理、机械 应力及化学腐蚀等方法，提出了一套适用性强、效率高的综合性倒装芯片组装集成电路开封工艺 技术，并通过实例进行验证和总结。通过运用该技术可以有效解决倒装芯片组装集成电路的开封 问题，为后续标准的修订及破坏性物理分析提供依据和帮助。 关键词：倒装芯片；结构分析；封装形式；环氧树脂；开封方法 中图分类号：TN307 文献标志码：A doi：10.11805/TKYDA201702.0328 Unsealing methods of flip chip assembly integrated circuit ZHOU Shuai，ZHENG Dayong，WANG Bin (China Electronic Product Reliability and Environmental Testing Research Institute，Guangzhou, Guangdong 510610，China) Abstract：The structure of flip chip assembly integrated circuit is different from conventional packaging, which brings that the current unsealing technology is not completely suitable for flip chip assembly integrated circuit. After analyzing the structures of flip chip assembly integrated circuits with different packaging forms, key factors which restrict the present unsealing technology can be found out. Taking ceramic and plastic sealed packaging flip chip assembly integrated circuits as examples, applying methods such as the heat gun, pretreatment under high temperature, mechanical stress and chemical corrosion, a set of comprehensive flip chip assembly integrated circuit unsealing technology with strong applicability and high efficiency i