WelcometoPROFITPacific-RimOutlookForumonIC.pptVIP

In this talk, I will first give a brief overview of the 3D IC technology, including the motivation and the challenges. Then we will look at our thermal-aware physical design flow for 3D ICs, including thermal model, the 3D routing and floorplanning algorithm, For the routing part, I will talk about both the core routing engine and the 3D routing with thermal via planning algorithm. If we have time, I will also talk about how the physical design flow is applied to an automatic 3D architecture evaluation tool. Finally, I will summarize my previous research projects and look at possible