Next Generation Non-Vacuum, Maskless, Low Temperature Nanoparticle Ink Laser Digital Direct Metal Patterning for a Large Area Flexible Electronics 英文参考文献.docVIP

NextGenerationNon-Vacuum,Maskless,Low TemperatureNanoparticleInkLaserDigitalDirectMetal PatterningforaLargeAreaFlexibleElectronics JunyeobYeo1,SukjoonHong1,DaehooLee2,NicoHotz3,Ming-TsangLee4,CostasP.Grigoropoulos2*, SeungHwanKo1* 1Applied Nano Technology and Science Lab, Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Korea, 2Laser Thermal Lab, University of California, Berkeley, California, United States of America, 3Duke University, Department of Mechanical Engineering and Materials Science, Thermodynamics and Sustainable Energy Lab, Durham, North Carolina, United States of America, 4Department of Mechanical Engineering, National Chung Hsing University,Taichung,TaiwanR.O.C. Abstract Flexibleelectronicsopenedanewclassoffutureelectronics.Thefoldable,lightanddurablenatureofflexibleelectronics allows vast flexibility in applications such as display, energy devices and mobile electronics. Even though conventional electronics fabrication methods are well developed for rigid substrates, direct application or slight modification of conventionalprocessesforflexibleelectronicsfabricationcannotwork.Thefutureflexibleelectronicsfabricationrequires totallynewlow-temperatureprocessdevelopmentoptimizedforflexiblesubstrateanditshouldbebasedonnewmaterial too.Herewepresentasimpleapproachtodevelopingaflexibleelectronicsfabricationwithoutusingconventionalvacuum deposition and photolithography. We found that direct metal patterning based on laser-induced local melting of metal nanoparticle ink is a promising low-temperature alternative to vacuum deposition– and photolithography-based conventional metal patterning processes. The ‘‘digital’’ nature of the proposed direct metal patterning process removes theneedforexpensivephotomaskandallowseasydesignmodificationandshortturnaroundtime.Thisnewprocesscanbe extremelyusefulforcurrentsmall-volume,large-varietymanufacturingparadigms.Besides,simple,scalable,fastandlow- temperature processes