粉末冶金法制备Mo-30Cu合金微观组织研究.pdfVIP

学兔兔 第28卷第2期 粉末冶金技术 Vo1．28，No．2 2010年4月 Powder Metallurgy Technology Apr．2010 粉末冶金法制备Mo一30Cu合金微观组织研究 韩胜利 蔡一湘 宋月清 崔 舜 ’ 1)(广州有色金属研究院，广州 510650) 2)(北京有色金属研究总院，北京 100088) 摘 要： Mo-Cu合金具有高的导热系数和低的热膨胀系数，被广泛用作热沉材料和电子封装材料。采用液 相烧结法制备出Mo-3OCu合金，通过XRD、SEM、TEM等对该合金的微观组织结构进行了观察分析，结果表 明：该合金组织分布均匀，组织中只含有Mo、Cu两相，在两相之间有一Mo、Cu互溶区。对Mo一30Cu合金的室 温拉伸断口和轧制变形后的微观结构进行了分析，其断裂机制以cu相的撕裂为主，伴随有Mo、Cu界面的分 离，Mo、Mo晶粒间界面的分离和Mo晶粒的解理断裂。 关键词：电子封装材料；Mo．Cu合金；液相烧结；微观结构 Investigation on microstructures of Mo-30 Cu alloy prepared by powder metallurgy Han Shengli” Cai Yixiang“ Song Yueqing” Cui Shun ) ， ， ， 1)(Guangzhou Research Institute of Nonferrous Metals，Guangzhou 510650，China) 2)(Beijing General Research Institute for Nonferrous Metals，Bering 100088，China) Abstract：Mo—Cu alloys with the hi gher thermal conductivity and lower thermal expansion are widely used as electrical packaging materials and heat sink materials． Mo-30Cu alloy was prepared by liquid sintering．Mierostructures of the alloy were investigated with XRD，SEM，TEM etc．The results indicate that the microstructure of Mo-3OCu alloy is homogeneous，there are Mo phase and Cu phase in the alloy，a mutual solution zone is between Mo grians and Cu phase．The observations of the room temperature fracture and as—rolled microstructures of Mo一30Cu alloy by SEM and TEM show that the fracture mechanism is composed of copper binder fracture， molybdenum-copper binder interf