Sn-9Zn-xCu钎料钎焊6061铝合金接头组织和性能研究.docVIP

Sn-9Zn-xCu钎料钎焊6061铝合金 接头性能研究 崔反东，姚 军，李仕臣 （内蒙古工业大学材料科学与工程学院，呼和浩特 010051 摘要关键词6061铝合金Sn-9Zn 抗剪切强度 中图分类号：TG425.1 文献标识码：A Research on Microstructure and Performance of 6061 Aluminum Alloy Brazed Joints by Sn-9zinc-xCu Solder CUI Fandong1, YAO Jun1, LI Shichen1,TIAN Peng2,WU Zhao1 (1 School of materials science and engineering, Inner Mongolia University, Huhehot 010051；2 School of mechanical engineering,ShenYangLigongUniversity, Shenyang,110159) Abstract This paper reports the researches about the impact of Cu doping on 6061 aluminum alloy brazed joints by Sn-9zinc-xCu solder. Solder and welded joint are analyzed by scanning electron microscope (SEM) and energy spectrum analysis (DES), and tensile test was carried out on the joint fracture tissue. Results show that the addition of copper improves solder structure, and copper are dispersed in the matrix, the second phase from copper and zinc solution prevents zinc phase further growing up and oxidizing; From welded joint analysis we find that as the addition of Cu, zinc rich in solder and spherical aluminum solid solution in dissolving diffusion zone showed a trend of growing up after the first decreases and copper content of 0.2% is a cut-off point; Welding joint is good, and tensile test better when copper content is 0.3%, the shear strength increased by 1.5 times, fracture mainly dominates ductile fracture, fracture of the yuan in the zinc rich phase, copper zinc solid solution forming into the root of the second phase is to improve the strength of solder. Key words 6061 aluminum alloy solder Sn-9Zn shear strength ０ 引言 6061 铝合金作为一种较新的材料，因其具有良好的强度及耐腐蚀性和焊后加工性能，倍受研究者的关注[1]。随着电子工业和航天的发展要求铝一次焊接多焊点和对基体影响小，钎焊铝成为要解决的问题，但铝在钎焊时表面形成致密的Al2O3薄膜，大大降低了钎料的润湿性和扩散。传统的钎料Sn-Pb钎料由于良好的焊接性能被大量应用于电子、机电、仪表、轻工等行业[2]，但Pb及含Pb化合物对环境及人体的有害，含铅钎料的开发和实际应用受到限制甚至禁止，加上电子行业对钎焊的要求日益提高，而且Sn-Pb系合金抗蠕变性能差，研究能够替代传统Sn-Pb钎料的无铅钎料迫在眉睫 [3]。近年来，国内外研究工作主要集中在通过合金化和改善钎剂的方式提高拉伸性能、蠕变性能和焊料与基板润湿性等方面，以获得更加可靠的连接焊点。目前，业界普遍认为 Sn-Ag、Sn-C