直插式LED的各类资料(国外英文资料).docVIP

直插式LED的各种材料 The various materials of the direct LED Direct LED LED leds consist mainly of scaffolds, silver glue, chip, gold wire and epoxy resin. Support: 1) the role of the scaffold: for conducting and supporting 2) the structure of the scaffold: the scaffold is made up of the material of the scaffold, which consists of the five layers of material, copper, nickel, copper and silver. 3) the type of the scaffold: the belt holder for the condenser, the flat head for the Lamp of the large Angle astigmatism. A, 2002 cup/flat head: this kind of stents are generally not very high in the Angle and brightness requirements, and the Pin length is about 10mm shorter than the other brackets. The Pin spacing is 2.28 mm B, 2003 / flat head: generally used for Lamp phi 5 or above, the external pin is + 29mm, -27mm. The Pin spacing is 2.54 mm. C, 2004 cup/flat head: the Lamp, which is used as the Lamp for the number of phi 3, the Pin length and the spacing of the two. D, 2004LD/DD: used for blue, white, pure green, purple Lamp, weldable double line, cup depth. E, 2006: both poles are flat head, used for blinking Lamp, solid IC, welding multiple lines. F, 2009: a two-color Lamp with two wafers in the cup, three pin feet controlling polarity. G, 2009-8/3009: used for three-colour Lamp, with three chips and four pin pins. Second, the silver glue Silver glue: fixed and conductive. The main ingredients of silver glue: the silver powder is 75-80%, the EPOXY is 10-15%, and the additives are 5-10%. The use of silver sol, cold storage, thaw and fully stir well before the use, due to the silver glue place after a long period of time, silver precipitation, such as not mix will influence on the performance of the silver glue is used. Chip: The structure of light-emitting diodes and LED chips 1) the chips role: the chip is the main component of the LED Lamp, a light-emitting semiconductor material. 2), the composition of the chip, chip is used gallium phosphide (GaP), gallium arsenic (GaAlAs)