热超声倒装键合机视觉系统的设计与实现-中南大学学报.PDF

第 38 卷第 1 期 中南大学学报( 自然科学版) Vol.38 No.1 2007 年 2 月 J. Cent. South Univ. (Science and Technology) Feb. 2007 热超声倒装键合机视觉系统的设计与实现 李建平，邹中升，王福亮 (中南大学 机电工程学院，湖南 长沙，410083) 摘要：针对热超声倒装键合过程中对准工作的特点，确定合理的视觉自动对准方案，在对多种颜色和形状的 LED 光源进行实验对比的基础上，设计环形 LED 光源与单个 LED 发光二极管组合的照明方式，使芯片、基板表面亮 度一致且表面几何特征清晰。视觉软件以 HexSight 为核心，利用创建参考点实现不同目标的识别，并对 2 个 CCD 摄像机的控制方案进行优化。通过分析多次识别结果对单项误差进行评估，并以实验用 1 mm×1 mm 的表面有 8 个凸点的芯片为例计算视觉识别系统的综合误差，结果表明此视觉识别系统满足芯片键合时对定位精度的要求。 关键词：热超声倒装键合；机器视觉；HexSight 视觉软件；误差分析 + + 中图分类号：TP242.6 2 ；TP271 .4 文献标识码：A 文章编号：1672-7207(2007)01−0116−06 Design and realization of machine vision system in thermosonic flip-chip bonder LI Jian-ping, ZOU Zhong-sheng, WANG Fu-liang (School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China) Abstract: According to the fact that accurate alignment is very crucial in the process of chip package, the structure of vision alignment system in automatic thermosonic flip-chip bonder was presented. Based on experiments on various color and style LED lights, the single-color LED illumination composed of a ring LED light and some LED lamps was adopted to get uniform luminance within visual field. The vision software was developed based on HexSight, the method of recognition of different objects(chip substrate), control of two CCD cameras and key points of creating model for chip and substrate were presented. According to the recognition error of translation by experiments on scale 1 mm ×1 mm chips, the composite position error of the vision system was calculated,