Intr与oduction_Hot Runner Systems.ppt

热流道介绍/Introduction for Hot Runner System;热流道的品牌介绍;Page 3;Page 4;热流道是个什么？;Page 5;Page 5;Page 5;Page 5;Page 5;Page 5;Page 5;Page 5;Moldflow Moldflowhas three Mold Flow simulators for flow analysis. The Type of analyses: Filling Packing Cooling Warpage Fiber orientation Co-injection Injection compression 1.1. Fill analysis AIM: Comprises analysis and line balancing during the cavity filling phase with process parameter optimization. 1.2. Pack analysis AIM: Analysis carried out only following the fill analysis phase. Comprises analysis of the cavity filling phase and optimization of the packing phase, including analysis of the press required for the molding process. 1.3. Cooling analysis AIM: Comprises analysis of the mold cooling circuit and defines the actual cycle time. 1.4. Warpage analysis AIM: Analysis carried out only following the fill and pack analysis phases. Comprises any potential warpage that the produced item might suffer following the molding process. This analysis confirms whether the type of injection process and gate positions are correct or not.;热流道前期工作-模流分析;单位时间注塑量与胶口大小;单位时间注塑量与胶口大小;一些实用方法;一些实用方法;HOT HALF;HOT HALF WITH INCLINED NOZZLES;一些热流道类型图片;一些热流道类型图片;其他相关信息; End Thanks