无铅焊锡的成份筛选和其粉材的制造工艺.pdf

无铅焊锡的成份筛选及其粉材的制造工艺 The composition sieving of the unleaded soldering and the manufacturing craft of its powder material 上海 东建中 021 摘要 近年来，“无铅化”成为电子材料、微电子制造、电子封装、SMT 等有关 的国际研讨会和学术交流会的中心内容或者是主要议题之一，成了大大小小的电 子设备与技术展览中吸引受众眼球的醒目标志，几十种专业技术刊物几乎每一期 都有无铅专题，在百度或Google 等著名搜索引擎上，可找到的“无铅化”信息 有成千上万条，而且还在不断增加中。科技人员经过努力，对无铅焊料成分已经 达成的共识：以Sn 为基体，添加Cu, Ag, Bi, Zn, In 等合金元素，目前最佳的候 选方案为：95.5Sn/4.0Ag/0.5Cu 。无铅焊锡粉材是一种低熔点的合金,一般采用气 体雾化法生产，但存在着粒度粗(一般为30～70 m) 的问题，通过采用密封式高 压(五百大气压)水雾化法，可生产出更细的(一般30 m)合金粉末，整套设备占 地四十平方米，投资额二十五万。 SUMMARY In recent years, unleaded turn becomes electronics material,micro-electronics manufacturing,the electronics pack,SMT etc. relevant international seminar and the academic exchanges meeting of the center contents is one of the perhaps main subjects, becoming various electronics equipmentses and technique to exhibit medium attraction is refreshing among many eyeballs marking, several ten kinds of professional technique publications almost each time on expecting to all have unleaded special subj ect search engine in Badu or the Google etc. can find out of the unleaded turn information have thousands, and return at continuously on the increase.The personnel of science and technology anticipates the consensus that the composition has already reach to the unleaded material through effort :Take Sn as the base, increase Cu, Ag, Bi, Zn, In etc. metal alloy chemical element, the best candidate for election project currently is:95.5 Sn/4.0 Ag/0.5 Cu.The unleaded soldering powder material is the metal alloy that a kind of low melting point , the general adoption air fog turns the method production, but exists a grain of thick problem(currently 30～70 μm), turning a method through the adoption seal completely type high pressure(500 atmospheres press) water fog, can produce thinner metal alloy powder of(currently( 30 μm), t