Unit2.ppt

Unit 2 SMC is short for Surface Mounted Component and SMD is short for Surface Mounted Device. SMCs/SMDs are functionally no different form leaded components and mounted on the surface of the PCB. The solder joint is the most important one as it provided both electrical and mechanical connections. SMD are far more complex than conventional PTH devices. 2.1 Passive Components　无源元件 Passive components are those components that do not need power source to function, such as resistors ，capacitors，inductors, transformers, filters, potentiometers, trimmer capacitors, switches and connectors metal electrode leadless face (MELF) 2.2 Active Components 有源元件 There are two main categories of chip carriers: ceramic and plastic. The plastic chip carriers are primarily used in commercial applications. The ceramic packages provide good hermeticity and are used primarily in military applications as they are more expensive. We confine ourselves with the plastic packages which are used extensively for nonmilitary applications where hermeticity is not required. The most common plastic packages used are the discrete transistors known as small outline transistors (SOTs), small outline integrated circuits (SOICs) with gull wings leads, small outline devices with J wings (SOJ), plastic leaded chip carriers (PLCCs) with J leads, and fine pitch devices with gull wing leads known popularly by as minipacks or plastic quad flat packs (PQFPs). The SOIC is basically a shrink DIP(Double In-line Package) package with leads on 0.050 inch centers. It contains leads on two sides that are formed outward in what is generally called a gull wing lead. It is also called mini flat pack. Plastic leaded chip carriers (PLCCs) are almost a replacement for plastic DIPs, which are not practical above 40 pins because of excessive real estate requirements. The PLCCs come in a lead pitch of 0.050 inch with J leads that are bent under the packages. These packages have an equal number of J leads on all