FC封装基板简介.pdf

HDI Substrate “Pisa Tower”封装基板 简介 2011-04 Jiang Nan High Density Interconnection 需求与技术驱动 HDI Substrate 产品发展趋向 Jiang Nan High Density Interconnection 需求与技术驱动 HDI Substrate PCB与基板发展历程 Jiang Nan High Density Interconnection Technology Drivers HDI Substrate 需求与技术驱动 CSP- Chip Scale Package/Chip Size Package  IC package area/ Si Chip (Die) area 1.2  Micro BGA, uBGA Jiang Nan High Density Interconnection Technology Drivers HDI Substrate 需求与技术驱动 Flip Chip BGA Vs. Wire Bonding BGA  电性能 -- Shorter interconnection path -- Negligible interconnect inductance  热性能 -- More I/O ＝＞ More Heat -- More gate ＝＞ More Heat -- Increase gate density ＝＞ More Heat -- Heat sink can directly attach to the die on a full array FCBGA  组装技术限制 -- Wire bond pitch has become bottle neck for further die shrink  外形因子 -- Allow smaller package than WB BGA with given die size -- Thinner package is possible  成本因子 -- Shorter processes setting -- High productivity and time saving -- Lower material cost Jiang Nan High Density Interconnection HDI Substrate FCBGA