剪切力实验标准.pdfVIP

DIE SHEAR STRENGTH 1. PURPOSE. The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package headers or other substrates. This determination is based on a measure of force applied to the die, the type of failure resulting from this application of force (if failure occurs) and the visual appearance of the residual die attach media and substrate/header metallization. 2. APPARATUS. The test equipment shall consist of a load-applying instrument with an accuracy of 5 percent of full scale or 50 grams, whichever is the greater tolerance. A circular dynamometer with a lever arm or a linear motion force applying instrument may be used to apply the force required for testing. The test equipment shall have the following capabilities: a. A die contact tool which applies a uniform distribution of the force to an edge of the die (see figure 2019- 1). A compliant (conforming) material (e.g., nail polish, tape, etc.) may be applied to the face of the contact tool to ensue uniform force distribution on the edge of the die. b. Provisions to assure that the die contact tool is perpendicular to the die mounting plane of the header or substrate. c. A rotational capability, relative to the header/substrate holding fixture and the die contact tool, to facilitate line contact on the edge of the die; i.e., the tool applying the force to the die shall contact the die edge from end-to-end (see figure 2019-2). d. A binocular microscope with magnification capabilities of 10X minimum and lighting which facilitates visual observation of the die and die contact tool interface during testing. 3. PROCEDURE. The test shall be conducted, as defined herein, or to the test conditions specified in the applicable specific acquisition document consistent with the particular part construction. All die strength tests shall be counted and the