电子及微系统封装大作业剖析.docx

《电子及微系统封装》课程大作业报告书要求（201X-201X学年第 X 学期）题目：微加速度计MEMS器件的封装技术综述姓名：XXX学号：201XXXXXXX日期：201XXXXXX摘要随着MEMS技术的发展，惯性传感器件在过去的几年中成为最成功，应用最广泛的微机电系统器件之一，而微加速度计（microaccelerometer）就是惯性传感器件的杰出代表。微加速度计是以加速度的观点来测量物体运动的传感器，其理论基础是牛顿第二定律。如果初速度已知，就可以通过积分计算出线速度，进而可以计算出直线位移。结合陀螺仪（用来测角速度），就可以对物体进行精确定位。本文依托意法半导体的MEMS惯性传感器厚外延层制程(THELMA)， 对微加速度计加工工艺过程及封装工艺进行研究。THELMA虽比多晶硅表面微加工制程略复杂，但拥有独特的优点，准许实现较厚的结构，这对电容式惯性传感器极其有用，适用于制造加速计、陀螺仪和其它的MEMS器件。封装方法是使用一个玻璃粉低温晶圆级键合工艺，把惯性传感器封闭在两颗晶圆之间的密闭空腔内，然后再使用一个格栅阵列(LGA)封装平台技术封装芯片，把单个的传感器裸片放在半导体裸片的旁边（并列结构）或把传感器裸片和半导体裸片相互堆叠放置（堆叠封装）。这种封装方法可以在大面积的基片完成，因此成本相对较便宜。关键词：微加速度计，厚外延层制程(THELMA)，晶圆级键合工艺，堆叠封装AbstractWith the development of MEMS, inertial sensor became the most successful and one of the most widely used MEMS devices in the last few years. And micro-accelerometer is the representative of it. By measuring acceleration point of motion, Accelerometer is a kind of sensor, which is based on Newtons second law. If the initial velocity is known, it can be calculated by integrating the linear velocity so that the displacement can be calculated. Combined gyroscope (angular speed), you can pinpoint the object.The paper is based on MEMS inertial sensor thickness of epitaxial layer process (THELMA) of STMicroelectronics, to study the processing and packaging of micro-accelerometer. THELMA is more complicated than poly-silicon surface micromachining, but has the unique advantage of allowing structures to achieve thicker. It’s extremely useful for the capacitive inertial sensor, and applicable to the manufacture of MEMS accelerometers, gyroscopes and other components. Package method is using the glass powder in the low temperature of the wafer level bonding process. Putting inertia sensor in two star Crystal round of closed empty cavity , then again using a grid gate array column (LGA) package platform technology to package chip, next putting single of sensor nude tablets next to the semiconductor nude tablets (tied structure) or putting sensor nude tablets and semiconductor nud