【内存条维修技巧之三】 典型故障检测分析和维修实例（国外英文资料）.docVIP

【内存条维修技巧之三】 典型故障检测分析和维修实例（国外英文资料） In this paper, by JGZXLJF contribution Memory chips maintenance skills # 3 】 【 typical fault detection analysis and instance memory maintenance skills # 3 】, published in the 2008-8-23 08:04 | only look at the author | reverse KanTie | printing This post by beibei in the 2009-8-27 22:41 editor/e) `; Y8 I) {S 1, particle primer welding is the most common type of non-device technical fault. Phenomenon: alarm when the mainboard is inserted directly, the main plank is not bright. With a strip, you can boot the system under DOS. Detection: when using RST, one or several data bits, the vertical column has a high capacity depth, which is perfectly red. In the multimeter, the relative data bit 22 ohm resistance was changed. Reason: due to the process, the backflow welding is not fully welded when the factory produces the memory stick, which only makes the pins of the particle stick to the solder. In the process of long-term use, the high temperature will dissolve the solder on the foot and make the connection break. Obstacle: DDR1 generation granule: take a small amount of flux on the foot of the malfunctioning particle and use the method of towing the soldering, resoldering the whole primer. DDR2 granule: after the granule of the granule flux, it will be blown around with a hot air gun, and if it is not effective, then it will be removed and then replanted the beads and the granules. Note: after welding, be sure to do the cleaning of the gold fingers before inserting the mainboard. Attached: maintenance appliance: miscellaneous CARDS 865GV motherboard with AGP graphics card, RST detection software, other tools. Similar phenomena: 1. This phenomenon occurs when the resistance occurs, but the solution is different, and the post will be introduced. 2, the data bit of the particle is physically damaged, but the solution is different, and the post will be introduced. 3, the gold finger dirty also can happen the same phenomenon, so must develop