BGA 流程图.pptVIP

BGA Process Flow Presentation Why assembly of dice？为什么要封装芯片 ELECTRICAL INTERCONNECTION 电连接 MECHANICAL SUPPORT/HANDLING/SOLDERING 提供机械支持，便于处理及电焊 PHYSICAL/CHEMICAL/RADIATION PROTECTION 防止物理/化学/辐射物损伤 POWER DISSIPATION 散热 How to assemble the dice?如何封装芯片 BGA PROCESS FLOW BGA生产流程 Molding模封 Marking 打印 Singulation切割 Packing 包装 BGA process flow presentation Shenzhen STS Microelectronics Wafer Mount Wafer Saw Die Attach Wire Bond Molding Marking Solder balls Placement Singulation Testing Packing Wafer Mounting 贴片 Operation: To stick wafer on adhesive tape 操作： 将来料晶片粘贴在蓝膜上 Aim: To susta