硬件构件的形式化描述及其组装机制.PDFVIP

36 8 2010 4 Vol.36 No.8 Computer Engineering April 2010 ·· 2010 A TP303 ( 450002) 4 Hardware Component Formal Specification and Its Composition Architectures HUANG Wan-wei, LAN Ju-long, YU Jing, LI Peng (National Digital Switching System Engineering Technological RD Center, Zhengzhou 450002) AbstractAn abstract model of hardware basic component is presented to design router and switch platform based on components, providing formal specification of disposal process inside the basic component, four atomic composition architectures used to construct higher layer compound component are described in formal semantic, including sequential architecture, parallel architecture, embranchment architecture and polymerization architecture, providing the abstract model and formal specifications of disposal process inside the compound component. The proposed approach offers a facility to construct compound hardware platform by components with higher granularity. Key wordsbasic component; formal specification; atomic composition; compound component; granularity [4] 1 Hc (Hardware Component)(I , C, F , O) 1 I I {I 1 ,I 2 ,I 3 } 3 O [1] C x C( x)