FPC设计原则.pptVIP

Multilayer FPCDesign Rule Multilayer Structure - 1S+S Type Air Gap FPC Multilayer Structure - 2 S+S+S+S Type Air Gap FPC Multilayer Structure - 3 S+D Type Air Gap FPC Multilayer Structure - 4 D+D Type Air Gap FPC Multilayer Structure - 5 S+S+S+S Type Air Gap FPC Photo Multilayer Structure - 6 D+D+D Type Air Gap FPC Photo Tools Capability Patterning - 1 Patterning - 2Through Hole and Through Hole Land Cover Coat Cover Layer Hole Punching Dimension - 1 Cover Layer Hole Punching Dimension - 2 Cover Layer Hole Punching Dimension - 3 Relationship Between Land and Cover Layer Cover Layer Hole Punching Dimension - 5 ICHIA TECHNOLOGIES, INC. 誠心、用心、創新、成就無限 Ichia Technologies, Inc. FPC Business Unit Sept. 2003 Lamination Preparing PTH Exposure / Etching Coverlay Lamination Surface Plating O/S Test = Blanking Drill Silver Paste Insulator Printing Shielding Layer Design : Silver Paste Printing Drill Lamination Preparing Internal Layer Exposure / Etching / Lamination Coverlay Lamination Exposure / Etching Surface Plating PTH O/S Test = Blanking Silver Paste Insulator Printing Layer 1 Layer 2 Layer 3 Layer 4 1) To print silver paste as shielding or 2) Use Layer 1 Cu or Layer 4 Cu as shielding Drill Lamination Preparing Internal Layer Exposure / Etching / Lamination Coverlay Lamination Exposure / Etching Surface Plating PTH Silver Paste Insulator Printing O/S Test = Blanking Layer 1 Layer 2 Layer 3 1) To print silver paste as shielding or 2) Use Layer 3 Cu as shielding Drill Lamination Preparing Internal Layer Exposure / Etching / Lamination Coverlay Lamination Exposure / Etching Surface Plating PTH Silver Paste Insulator Printing O/S Test = Blanking 1) To print silver paste as shielding or 2) Use Layer 1 Cu and Layer 4 Cu as shielding Layer 1 Layer 2 Layer 3 Layer 4 Air Gap Part Air Gap Air Gap Part Air Gap Hole to hole Hard Tool ±0.05 ±0.05 —