PCB(印刷电路板)加工临盆的流程(国外英文资料).docVIP

PCB(印刷电路板)加工生产的流程(国外英文资料) The speaker is not guilty. If you dont eat, you cant eat. There was no trace in the deep lane of the day, when the pear chips were opened. He who has a stone may attack the jade. The desert is lonely and the river is falling. PCB (printed circuit board) of raw material is glass fiber, the material we source visible in daily life, such as the core of the fire prevention cloth, fire blanket is glass fiber, glass fiber and resin combination of easily, we put the structure compact, high strength glass fiber cloth into resin, hardening have insulation insulation, not easy to bend the PCB substrate, if break PCB, layered edge is white, is enough to prove that the material of plastic glass fiber. We cant transmit electrical signals on the insulation board, so we need to cover copper on the surface. So we call it the cladding base board. In factories, common copper clad substrate code is FR - 4, this generally there is no difference in each card by the manufacturer, so we can believe that everyone in the same starting line, of course, if it is a high frequency board, it is better to the high cost of ptfe glass cloth copper-clad laminate. Copper clad process is very simple, generally can be made of rolling and electrolytic solution, the so-called calender is copper with high purity ( 99.98%) rolling method on the PCB substrate, because epoxy resin has good adhesiveness with copper foil, copper foil adhesion strength and working temperature is higher, can dip in 260 ℃ of molten tin welding without bubbles. The process is a lot like rolling wrappers, and the thinnest can be less than 1mil (the industrial unit, which is a thousandth of an inch, or 0.0254 mm). If the wrappers are so thin, the pan must leak! So-called electrolytic copper this chemistry in junior high school has learned, CuSO4 electrolyte can continuously produce layers of copper foil, so easy to control the thickness, the longer the more thick copper foil! There is a strict requirement