SMT1(国外英文资料).doc

SMT1(国外英文资料) SMT common adverse Air soldering - no tin or other factors can be caused by a part foot or a lead foot and a tin pad. False welding - the phenomenon is similar to empty welding, but the tin pads are too small and below the joint surface standard. Cold solder - the tin or tin paste is still in a mushy particle on the tin pad after the blast furnace is vaporized. Bridge - with foot parts being short-circuited between feet and feet, another is used with tweezers, bamboo sticks... The foot and foot can be short-circuited by improper operation, or the scrape of the foot caused the residual tin to short-circuit the foot and the foot. The wrong item -- the specification or type of the part to be placed in accordance with the provisions of the job or the BOM, the ECN discrepancy, is the wrong one. Missing piece -- the address of the part should be placed and the vacancy will be caused by the abnormal cause. Polarity reversal -- polarity orientation is not the same as the assembly of the process engineering, which is a polarity error. The parts of the parts should not be inverted, the parts of the SMT should not be inverted, and the other CR is not marked by the bottom of all white, although the non-polarity is not to be dumped. Partial offset - the surface of all parts of SMT is then solder and the PAD deviation should not exceed 1/2 area. 10. - tin solder PAD damage cushion (PAD) in normal process, through the return air gasification furnace welding can not damage the solder pads, generally the reasons of the solder PAD damage, used to mend the soldering iron properly solder pads are destroyed, light person can restore normal shipment, serious in subprime product decision, scrap or transplantation. 11. Pollution is not clean, SMT processing work, board face caused by unclean or between ones feet and legs with foreign body, or one repair bad, a little glue, solder joint touch paint are considered to be nonconforming. However, the visual situation of the supplem