一种铜丝结构的新型微槽道平板热管_林振玄.pdfVIP

　61 　 1 　 　　　　　　　 　　　　Vol.6 1　No.1 　 20 10 1 　 　CIESC　Journal　 　　January 　20 10 林振玄, 马　琦, 汪国山, 刘振华 (, 200240) :, 40、 50 60 ℃3 , 。 、 、 , 。 :;; :T K 124 　　　　　　　:A :0438-1157 (2010)01-0027-05 T hermal performan e of a new opper wire-bonded flat heat pipe LIN Zhenxuan, MA Qi, WANG Guoshan, LIU Zhenhua (Schoolof Mechanical Engineering, Shanghai J iao Tong University , Shanghai 200240, China) Abstra t :An experimental study w as arried out to investigate the thermal performan e of a new type of opper wire-bonded flat heat pipe.The influen es of w orking fluid, steam temperature, w ire diameter and wire gap on the thermal performan e of the heat pipe w ere investigated to design the optimal onstru tion.Experimental results show ed that wire diameter had an important effe t on heat transfer but hardly had any impa t on maximum heat flux.The w ire gap not only had an important effe t on heat transfer but also had a signifi ant impa t on maximum heat flux . Key w ords:heat pipe;heat transfer;evaporation 。 　 , [5-14] 。, [15] , , , , 。, , 。 。 , 、 [15] , 。 。Peterson , , 。 [1-4] 。 Peterson , , 、 , 、 。1 mm 　　2009-05-07 , 2009-10-10 。 　　Re eived date:2009-05-07. :。 : (1985—), , Corresponding auth or:Prof.LIU Zhenhua, liuzhenh @sjtu. 。