有关微细尺度传热问题的研究进展1.doc

有关微细尺度传热问题的研究进展 余益松 (常州大学石油工程学院 常州 213002) 摘要：随着科技的进步，以及技术应用的需求，工程学在微观领域取得了长足的发展。一方面器件的特征尺度越来越小，已经从微米量级向亚微米量级发展。另一方面器件的集成度也不断增大。高的集成度不仅对技术要求提出了挑战，而且可以想象，如此多的集成元件会使热流密度很大。这样的矛盾充分体现在高密度的微电子领域。如此多的热量如何能够快速的传递的出去，以保证机械的正常运转。这给工程师们造成了很大的困扰。微细尺度传热问题便是在这种背景下发展起来的。无论是在国内还是在国外，这个问题已经成为制约微型电子机械系统发展的一大障碍。工业、国防、航空、航海、医学、生物工程以及农业的“微型化”发展，迫切需要解决散热这一基础性的问题。为此国内外的许多学者对这方面做了很多的研究工作，但经过三四十年的发展其所取得的成果依然很少，甚至不同的学者对这一问题持有相反的观点。至今对这一问题仍然没有形成一个统一的认识。本文通过简要的介绍微尺度传热问题的由来、特点、内部机理、所遇到的问题、发展前景及其所涉及主要的研究方向，使读者对这一问题有一个初步的认识和了解。 关键词：特征尺度；集成；微细尺度；散热；传递 Research progress of the micro-scale heat transfer problems Yu yisong （Changzhou University of Petroleum Engineering, Changzhou, 213002, China;） Abstract：With the advancement of technology, and technology applications demand, the engineering has made considerable development in the microscopic field. On the one hand, the characteristic scale of the device is getting smaller and smaller, from microns to submicron development. The other hand, the device integration is also increasing. The high degree of integration is not only a challenge on the technical requirements, but you can imagine, so many integrated components cause the heat flux. This fully reflects the contradictions in the field of high-density microelectronic. How so much heat can be quickly passed out, in order to ensure the normal operation of the machinery? This caused a lot of distress to the engineers. A micro-scale heat transfer problem is developed in this context. Whether at home or abroad, this issue has become a major obstacle restricting the development of micro-electro-mechanical systems. Industrial, defense, aviation, marine, medical, bio-engineering, and agriculture miniaturization development, there is an urgent need to address the basic problem of the heat. This home and abroad many scholars in this area to do a lot of research work is still very small, but after three or four decades the development of their achievements, and even different scholars hold the opposite