摘录——助焊剂常见问题(国外英语资料).doc

摘录——助焊剂常见问题 First, after welding, PCB surface residue is more, less clean: 1. before welding without preheating and preheating temperature is too low (dip, short time). The 2. approach is too fast (not fully volatile flux). 3. furnace temperature is not enough. 4. tin liquid is added with anti oxidant or anti oxidation oil. 5. flux coating too much. The 6. element foot is out of proportion to the plate hole (Kong Taida) that causes the flux to rise. 9., the use of flux in the process, for a long time without adding thinner. Two flammable: 1., the wave furnace itself has no wind knife, resulting in excessive coating amount of flux, preheating drops to the heating tube. The angle of the 2. air knife is incorrect (uneven coating of the flux on the PCB). Too much tape on the 3.PCB causes the bar to ignite. The 4. approach is too fast (F flux is not completely volatile, FLUX drop) or too slow (caused by hot plate temperature is too high). 5. process problems (PCB sheet is bad and heating pipe is too close to PCB). Three, the corrosion (green components, black spot) 1\ is not fully preheated (preheating temperature is low, equal speed) caused by residual flux, harmful residue too much). 2\ use flux that needs cleaning, not cleaned or cleaned in time. Four, power flow, easy leakage (bad insulation) 1.PCB design is unreasonable, wiring is too close, etc.. 2.PCB solder coating is of poor quality and easy to conduct. Five, leakage welding, weld, solder 1. flux coating too little or uneven. The 2. part of the pad or welding foot oxidation is serious. 3.PCB wiring is unreasonable (parts are not distributed properly). 4. foam pipe blocked, uneven foaming, resulting in uneven FLUX coating on the PCB. Improper handling method for 5. hand dipping tin. 6., the chain angle is unreasonable. 7. peaks uneven. Six, the solder joint is too bright or the solder joint is not bright 1. can solve this problem by choosing bright or extinction type soldering flux; 2. tin is not good (e.g. tin