柔性电路数字印刷(国外英语资料).docVIP

柔性电路数字印刷 Flexible circuit digital printing new process Printable conductive metals often have to compromise between the rheological properties and the conductivity of the material. Binders and carriers used to provide mobility during printing and adhesion of substrates affect the conductivity of the final composite layer and prevent the current from passing through the wires. But there is a process that provides a way to limit the addition, preparation, and adhesion of the substrate without the transmission of the printed part. Conductive ink technology (CIT) develops a process in which the ink is imprinted on the substrate and cured by ultraviolet radiation to provide an adhesive base for rapid processing. The substrate itself does not have conductivity, but its electroless plating on the metal layer acts as a catalyst. Curing substrate printed is immersed in commercially available electroless plating tank, and the trench top thick metal layer deposition process. The two stage process allows the plating bath to be optimized for different substrate materials and different printing tools, without affecting the conductivity of the final process. The process uses most standard electroless metals, including nickel, cobalt, and palladium, but the most widely used and most widely used are copper. Two stages of the process can be performed online or after electroless plating is performed as batch processing. The average growth rate of copper is between 20 nm per minute to 90 nm per minute (equivalent to a large volume of copper), and it produces 30 ohm film resistance during the 10 minute plating process. In general, the resistance coefficient is 2.5 times larger than that of bulk metals (copper), depending on the plating bath and the conditions used. The optimum conduction range of the CIT process is greater than 10 ohms (equivalent to 1.5 to 2 micron bulk copper). It is suitable for wide application, including ultra high frequency radio frequency identification (UHF RFI