- 1、本文档共7页,可阅读全部内容。
- 2、原创力文档(book118)网站文档一经付费(服务费),不意味着购买了该文档的版权,仅供个人/单位学习、研究之用,不得用于商业用途,未经授权,严禁复制、发行、汇编、翻译或者网络传播等,侵权必究。
- 3、本站所有内容均由合作方或网友上传,本站不对文档的完整性、权威性及其观点立场正确性做任何保证或承诺!文档内容仅供研究参考,付费前请自行鉴别。如您付费,意味着您自己接受本站规则且自行承担风险,本站不退款、不进行额外附加服务;查看《如何避免下载的几个坑》。如果您已付费下载过本站文档,您可以点击 这里二次下载。
- 4、如文档侵犯商业秘密、侵犯著作权、侵犯人身权等,请点击“版权申诉”(推荐),也可以打举报电话:400-050-0827(电话支持时间:9:00-18:30)。
查看更多
3d打印机测试(国外英语资料)
3d打印机测试(国外英语资料)
1, the diode D1 ramps to power a mega board welding, also is the need to separate to mega2560 board power supply, direct use of usb 5 v power supply or by power joint (official advice not more than 12 v power supply). Please understand. Friends who want to print out the LCD will also need to power the ramps1.4, otherwise they wont be able to use it.
2, the power supply is reversed, the motor drive plate is connected to the reverse and will be possible to burn the chip and the circuit, please reconfirm and then carry out the electricity.
Modules and devices that need to be used:
Arduino Mega2560 main control board (the kit includes) : this is the brain of a 3d printer, which controls the entire printer to complete certain actions, such as printing specific files, etc.
RAMPS1.4 (the suite contains) : this is the main control board expansion board, it is in order to better connect with other hardware and control, have the effect of the bridge;
A4988 stepper motor driver board, the suite includes: this is used to connect a stepper motor, so as to realize the control of main control threatening the stepper motor, realization of XYZ and extruder action;
4 ~ 5 stepper motors (the kit does not contain) : this is the power part of a 3d printer, controlled by the A4988 driver, and the motor is connected to the RAMPS1.4 board.
Heating head (the suite do not contain) : heating head is used to melt print material (ABS, PLA, etc.), heating the head commonly there are two electrical components, a heating wire can be used to heat, after the power supply is similar to the electric heating furnace, the other is a thermistor, how much is used to retrieve the current temperature heating head, so as to realize better temperature control, due to the firmware (Marlin:/ErikZalm/Marlin/tree/Marlin_v1) of temperature to be successful before allowing for many operation, so even a simple test also need to connect two thermistor (another used to obtain hot bed temperature),
Hot
您可能关注的文档
- (转)美国人教你这样用Google,你真的会变特工~~~()(国外英语资料).doc
- (medical) the point of knowledge of the TXT ().((医学)断层解剖TXT版知识要点())(国外英语资料).doc
- (下末)五年级语文期末试卷((bottom) fifth grade Chinese final examination paper)(国外英语资料).doc
- (关节脱位、脊柱骨折)((joint dislocation, spinal fracture))(国外英语资料).doc
- - Oracle backup and recovery and use the problem set () in the Oracle9i process.(- Oracle备份与恢学习并使用Oracle9i过程中的问题集())(国外英语资料).doc
- 05-2-1. What kind of future can the Chinese wang reduce(05-2-1.汉王降价,能降出个怎样的未来)(国外英语资料).doc
- 03-3-5. Cloud computing makes the future full of imagination(03-3-5.云计算让企业未来充满想象)(国外英语资料).doc
- 02-hub (HUB)(02-HUB(集线器))(国外英语资料).doc
- 09防火墙(国外英语资料).doc
- 1-5年的积累背诵(国外英语资料).doc
- 1-1-3-3 初中化学课后练习.doc
- 11-12学年高中数学 第一章 导数及其应用 综合检测 新人教A版选修2-2.doc
- 11-12学年高中数学 1.5.3 定积分的概念同步练习 新人教A版选修2-2.doc
- 08、初中物理电和磁阶梯训练.doc
- 11-12学年高中数学 1.2.1 几个常用的函数的导数同步练习 新人教A版选修2-2.doc
- protecting-epo database with mcafee security使用数据库安全保护.pdf
- 企业数字化转型投入产出关系研究报告—数字化转型助力高质量发展.pdf
- 2024年北京车展分析报告——智驾篇.pdf
- 半导体设备专题:玻璃基板从零到一,TGV 为关键工艺.PDF
- 大模型训练数据白皮书.pdf
文档评论(0)