半导体激光切割金属薄板工艺-光电工程.PDFVIP

第43 卷第 9 期 光电工程 Vol.43, No.9 2016 年 9 月 Opto-Electronic Engineering Sept, 2016 文章编号：1003-501X(2016)09-0089-06 半导体激光切割金属薄板工艺 1 1 2 1 蔡锦达 ，陈 涛 ，王 颖 ，陟俊杰 ( 1. 上海理工大学 机械工程学院，上海 200093 ； 2. 中国科学院上海光学精密机械研究所，上海 201800 ) 摘要：本文使用高亮度半导体激光器作为光源，对不锈钢和碳钢板材进行了激光切割实验。实现对半导体激光切 割可行性的验证，并对切割过程进行全面分析。实验表明：在以氧气做辅助气体时，大部分切割能量来自于材料 的氧化过程，而激光输出能量推动氧化反应持续进行；以氮气为辅助气体时，激光的功率密度和激光的总输出功 率是影响切割结果的主要因素；500 W 半导体激光适合切割 3 mm 左右的金属板材，切割效率与光纤激光接近， 并且可以得到相似的切割表面和切缝形态。结合氧助激光切割碳钢的工艺特点，通过优化方案可提高半导体激光 对碳钢的切割能力，使此功率水平的半导体激光在氧气辅助条件下可以成功切割 6 mm 厚度碳钢板。 关键词：半导体激光；激光切割；光纤激光；切割工艺 中图分类号：TG485 文献标志码：A doi：10.3969/j.issn.1003-501X.2016.09.016 Metal Sheet Cutting Process Using Diode Lasers 1 1 2 1 CAI Jinda ，CHEN Tao ，WANG Ying ，ZHI Junjie ( 1. School of Mechanical Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China; 2. Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Shanghai 201800, China ) Abstract ：In the experiment, laser cutting was performed on stainless steel and carbon steel by using high brightness diode laser as light source. The experiment verified the feasibility of the diode laser cutting, and analyzed the cutting process comprehensively. When using oxygen as auxiliary gas, most cutting energy was from the oxidation, which was promoted by laser. When using nitrogen as auxiliary gas, the main factors that influenced the cutting results included the total