生产数据半导体工具故障分离(SETFI Manufacturing data Semiconductor Tool Fault Isolation)_数据挖掘.pdfVIP

生产数据:半导体工具故障分离(SETFI: Manufacturing data: Semiconductor Tool Fault Isolation) 数据介绍： During the semiconductor fabrication process each wafer goes through a product specific sequence of operations (hundreds) in batches - lots. Every lot goes through each operation in the sequence. At each operation a lot could go through only one of many tools performing the same function. Maximum number of tools could up to 25, and the number of tools could be different from operation to operation. At the end of the manufacturing line many performance metrics are measured to monitor deviations from the desired target specifications. Often observed variation of a performance metric is caused by a subset of tools with effects of the problematic tools potentially changing in time. The simulated dataset closely reproduces the nature and complexity of the tool level fault isolation problem engineers face in the semiconductor manufacturing. It records every tool and time stamp at every operation every lot went through (predictors), and the corresponding numeric performance measure (targ 关键词： 回归分析,特征选择,信号分离,半导体工具,故障分离, regression,feature selection,signal separation,semiconductor tool,fault isolation, 数据格式： TEXT 数据详细介绍： SETFI:Manufacturing data: Semiconductor Tool Fault Isolation Contact: Eugene Tuv - Submitted: 2008-11-24 23:46 - Views : 1103 - [Edit entry] Authors: AAYA, Intel Key facts: The dataset has 602 variables and 4000 observations (lots); RES is the target - the performance metric measured at the end of line; LOT coded as LOTID (to be ignored); the rest are predictors: LOCNi and TDATEi. Every lot goes through each of 300 operations: LOCNi (operation ID) at time TDATEi, i=1-300. At each operation it could go through only one of the tools. Hence LOCNi are categorical predictors with number of levels= number of tools used, TDAT Ei are numeric variables (coded times through operat