HDI流程(PCB)的.pptVIP

;HDI PCB的應用;HDI及一般PCB用的主要物料介紹;一般PCB製作流程簡介;內層線路﹕ 裁板?前處理?壓干膜?曝光?顯影?蝕銅?去膜?AOI檢驗;外層線路（2）﹕電鍍銅（Pattern）?電鍍錫?去膜?蝕銅?剝錫?AOI檢驗;成形﹕切外形 ? V-cut 等 ? 清洗 ? 測孔機測孔;Micro Via Design Rule ( HDI) --- Blind via Design rule and capability --- Buried via Design rule and capability;MINI PRINTER;B;D;A;Benefit of HDI Process;疊板設計;HDI產品製作流程示意圖;發料 Issue material;黑化 Black oxide;Conformal Mask及Laser Drill制作原理;Conformal Mask 制作流程;Mechanical Properties Build-Up Layer RCC Convention PP LDP Prepreg Dimension Stability Poor Good Better Warp Twist Poor Good Better Rigidity Poor Good Better Thickness Control Poor G