FC介绍2014.ppt

FC Workshop Layout Process Flow Raw Material List Solder-Bumped Flip Chip Equipment List Reliability Test Reliability Test Report WUXI CHINA RESOURCES MICRO-ASSEMBLY TECHNOLOGY CO.,LTD- 无锡华润安盛科技有限公司 * ANST Confidential * * ANST Confidential Flip Chip Assembly Technologybased on lead frame Table of content FC Workshop Layout Process Flow Raw Material Equipment Reliability Test Major Defect Mode At present: 3lines, 17bonders output:1700k/day product: FCSOIC/FCTSOT/FCQFN Planning: 3lines, 24bonders output:2800k/day product: FCSOIC/FCTSOT/FCQFN BGA/CSP Process Flow (FC Process) dipping flux place reflow flip pick die bonder ESEC2100FC reflow oven BTU Pyramax100N ITW 3201015650 Tube Form/ Singulation Asahi Solder Tech Pure tin Lead Finish Plating Sumitomo EME-G600 Compound Molding Alpha Alpha NCX Dipping Flux Mitsui SOIC 08LD C9-BSM TSOT 05LD C9-BSM TSOT 06LD C9-BSM TSOT 08LD C9-BSM QFN 14LD C9-BEM(2*3PKG) QFN 34LD C9-BEM(6*6PKG) Lead Frame Flip Chip Bonding Hitachi HAE-1503L WM Blue Tape Wafer Mount Mitsui SB-340HV-U20 B/G UV Tape Back Grinding SUPPLIER PART#/MODEL NAME RAW MATERIAL PROCESS FC Lead frame Capability DESCRIPTION 6mils Thickness 8mils Thickness L1: Lead clearance ≥ 0.125mm ≥ 0.150mm L2: Lead width ≥ 0.150mm ≥ 0.150mm DESCRIPTION Design Rule D: Bump edge to lead edge ≥ 30um(15um MIN) P: Bump pitch ≥ (r1+r2+2D+L1) Lead planarity (from dam bar) are controlled as : +/- 0.025 mm for etch frame +/- 0.04 mm for stamp frame FEATURED DIMENSION 1.Bumping Ball Size (D) 120 150 μm 2.Total Bumping Height (TH) COPPER PILLAR: 65 μm SOLDER HEIGHT: 35 μm 3.Bumping Pitch (P) 250 μm 4.Bumping Ball Composition 100% Sn/95%Sn+5%Ag 5. Copper Pillar Composition 100% Cu 6. Minimum Scribe Line 50um TURBOVAC SB820S-KK Pack Machine IPK ASM MP209 Form System Auto-F/S System Form/Singulation System: EO Technics Handler: GPM System: EO Technics Handler: GPM Auto-Laser Marker Marking Tabai Mfg. Co. T