蚀刻技术 - sharecourse.pdfVIP

理論 Lecture 8 (Etching) 理 立 料 1 Outline Introduction How to Control Etching Process? Isotropic Wet Etching Anisotropic Wet Etching Dry Etching 2 立 料 理 Lecture 4 Lecture 4 Lecture 58 Lecture 58 3 立 料 理 類 路 理 兩 留 路 兩 類 4 立 料 理 Types of Etching Processes Isotropic (): Best to use with large geometries, when sidewall slope does not matter, and to undercut the mask Quick, easy, and cheap Anisotropic (): Best for making small gaps and vertical sidewalls Typically more costly 5 立 料 理 Etch Parameters Etch Rate (率, r): Rate of material removal (µm/min) Function of concentration, mixing, temperature, … Etch Selectivity (, S=r /r ): 1 2 Relative (ratio) of the etch rate of the film to