moldflow_改善产品变形问题.ppt

* Reported: Bill.Bin *-28 1. Project Summary2 2. Plastic material information 3 3. Analysis purpose Process condition 4 4. Part information, Runner and cooling system design 6~8 5. Analysis result9~27 6. Conclusion suggestion 28 Mold Flow Report Mold Flow Report case1 case2 Mold NO：Ｂ１０２７４ Prepared by: Bill.Bin Cavity number:1*2 Analysis purpose : improve warpage。 Analysis Project: Cool +Fill +Pack + Warp Case1 is the 3D design. Case2 is revise mold design and modified the process condition. / Material Property Viscosity vs Shear rate P-V-T 14. Measured MFR 3 g/10min(5kg/200.C)) 7. Melt Temperature Minimum 200deg.C 13. Thermal conductivity 0.19(k)w/m.c 12. Maximum Shear Stress 0. 5 Mpa 11. Maximum Shear Rate 50000 1/s 10. Mold Temperature Maximum 80deg.C 9. Mold Temperature Minimum 40deg.C 8. Melt Temperature Maximum 240 deg.C 6. Filler unfilled 5. Recommended Melt Temperature 220deg.C 4. Recommended Mold 60 deg.C 3. Ejection Temperature 90 deg.C 2. Solid Density : 1.0494g/cu.cm 1. Melt Density : 0.96055g/cu.cm ABS Polylac PA-737 Manufacturer : Chi Mei Corporation Process setting Analysis purpose: improve warpage Analysis Project: Cooling + flow + Warpage Process setting case1 Mold Temperature:60/65℃ Melt Temperature: 220℃ Fill Time: automatic Cooling time:60S V/P switch-over: 99% of filled volume pack 80%V/P 10S case2 80%X0.3+0X1.5+6X60%+12X100%S Part infomatiom Thickness distribution Cooling system design All case is base 2d mold design. Runner system design Case1 is base 2d mold design ， ?12mm ?10mm ?8mm ?2.8~8mm ?10~2.8mm case1 Runner system design case2 Same case1 Same case1 Same case1 case2 is reviser runner system (move gate ) Move gate Fill Time The fill time result shows the position of the flow front at regular , as the cavity fills. Ea