IC封装大全（国外英文资料）.docVIP

IC封装大全 IC package Daquan Add time: 2009-1-4 3:48:25, hits: 335 Source: Electronic Engineer, post Author: unknown -------------------------------------------------------------------------------- 1, BGA (ball, grid, array) Ball contact display, one of surface mount packages. A spherical bump is formed on the back of the printed substrate Instead of pins, the LSI chip is mounted on the front of the printed substrate and sealed with a molding resin or potting method. Also called convex Point display carrier (PAC). The pin can be more than 200 and is a package used in multi pin LSI. The package body can also be smaller than the QFP (four side pin flat package). For example, the pin center is 360 pin from the 1.5mm BGA is only 31mm square; and the pin center is 0.5mm from the 304 pin QFP to 40mm square. And, BGA, No. Worry about the pin deformation problem like QFP. The package was developed by Motorola, Inc., which was first introduced in portable phones and other devices, and is available in the United States in the future Be popular on personal computers. Initially, the BGA pin (Bump) center distance is 1.5mm, and the pin number is 225. Now too Some LSI manufacturers are developing 500 pin BGA. The problem with BGA is the appearance check after reflow. It is not clear whether an effective visual inspection method is available. Some believe that.., Because the center distance of the weld is greater, the connection can be considered stable and can only be handled by functional inspection. Motorola Corporation in the United States called encapsulated OMPAC sealed with molded resin, and sealed encapsulation of potting methods known as GPAC (see OMPAC and GPAC). 2, BQFP (Quad, flat, package, with, bumper) Four side pin flat package with cushion. One of the QFP packages is provided with a protrusion (buffer pad) in the four corners of the package body Prevent the pins from bending and deforming during transit. American semiconductor manufacturers are mainly used in microproc